SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF AND ELECTRONIC DEVICE USING THEREOF

摘要

PURPOSE: To provide a semiconductor device, on which LSI, etc., of very small type are mounted, and an electronic device using the semiconductor device. CONSTITUTION: The title electronic device in traverse direction can be miniaturized by forming boring slits 105' longer than the length of the side in longitudinal direction of a base film 104 by making contact with both left and right ends of a potting resin 102. The electronic device in longitudinal direction can be miniaturized by forming the tip part inside an outer lead group 107 extended to the inside of the mounting region 402 of an IC chip 303, namely, to the point located under the IC chip 303. The connection with the outside part can be accomplished on the above-mentioned part.