| 摘要 |
An integrated circuit chip die (12) is manufactured with sacrificial structures (16) placed at the areas of die that are likely to experience cracks. According to one embodiment of the invention, these sacrificial structures are placed at the corners of the die. The sacrificial structures are constructed with metal lines (22, 24) that resist propagation of cracks into the area of the die containing electronic devices. The metal lines form lattice steps so that the surface of the die will more tightly bond to the molding compound that makes up the die package. |
