| 摘要 |
PURPOSE: To provide a method of mounting semiconductor array elements, which aligns the elements with high accuracy. CONSTITUTION: In a method of mounting semiconductor array elements, which are subjected to flip chip bonding, the number of electrodes 3 to be connected electrically with the elemnts is assumed to be N to include (N+2) pieces or more of the electrodes in the N, the semiconductor array elements 1 are cut out from a semiconductor wafer to form and more than one piece of electrodes 2 provided at both ends of a group of the elements 1 are used as electrodes for alignment with substrates 6. |
