| 摘要 |
<p>PURPOSE: To provide a highly durable contact conformable to narrow pitch in an IC socket for inspecting and evaluating a BGA chip. CONSTITUTION: An upper pin 11 made of a conductive material and formed of a substantially disc-like upper pin head part 10 having an upper pin BGA contact surface 2 making contact with a BGA ball 1; and an upper pin slide contact part 3 is provided in contact with a receptacle upper contact 9 through a through-hole provided on a body 4 made of plastic. A receptacle 12 made of a conductive material and mainly formed of the receptacle upper contact 9 consisting of a one-point or multipoint contact; a receptacle return spring part 5 for mainly generating an elastic recovering force upward; a fixing projection 8 to be fixed to the body 4; and a solder tail part 7 to be extended through a base 6 and fixed thereto by soldering is inserted to a through-hole regularly provided on the body 4.</p> |
