发明名称 |
Method for forming multilayer wiring construction |
摘要 |
Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film is formed as a highly adhesive film on a low-thermal-expansivity polyimide film in a half-cured state, then metallic wiring is applied thereon, followed by formation of another highly adhesive thin film in a half-cured state, and then a low-thermal-expansivity polyimide film is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film and the wiring pattern layer or the substrate.
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申请公布号 |
US5570506(A) |
申请公布日期 |
1996.11.05 |
申请号 |
US19950463562 |
申请日期 |
1995.06.05 |
申请人 |
HITACHI, LTD. |
发明人 |
TAWATA, RIE;NUMATA, SHUNICHI;MIWA, TAKAO;FUJISAKI, KOJI;IKEDA, TAKAYOSHI;OKABE, YOSHIAKI;SHIMANOKI, HISAE |
分类号 |
C08G73/10;H01L23/498;H05K1/00;H05K1/03;H05K3/46;(IPC1-7):H01K3/22 |
主分类号 |
C08G73/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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