| 摘要 |
PURPOSE: To provide a manufacturing method to form a fine interconnection having a 3-dimensional shape in a thin-walled structure capable of preventing external electromagnetic interference and suppressing the influence of crosstalk noise produced in the interconnection. CONSTITUTION: A male die having a specified shape is prepared, a first metal film 2 to be a substrate is formed on the surface of the die by the Ni-plating, a first polyimide insulation film 3 is formed on the film 2, an interconnection 4 is patterned into a desired shape by the photoetching, a second insulation film 5 is formed, a second metal film 6 to avoid external electromagnetic interference is formed on the film 5 and a protective film is formed on the film 6. Finally the die is removed by the etching to produce a thin-walled structure 1 having a hollow part 9 with a fine interconnection robust to the electromagnetic interference. |
