| 摘要 |
PURPOSE: To prevent the generation of a crack, which is generated in a conductor circuit formed on the intersecting part of planes or a curved surface on a printed-wiring board, by a method wherein a continuous circuit is formed between the intersecting planes and the curvature of the surface of a bonding, layer on the intersecting part is formed larger than that of the surface of a substrate under the intersecting part. CONSTITUTION: In a printed-wiring board, at least one conductor circuit is formed on the surface of a substrate of a plastic molding 1, which has a continuous plane comprising more than two planes, which intersect each other, or a curved surface 1a, via a bonding layer 2. A continuous conductor circuit 3 is formed between the intersecting planes and the curvature of the surface of the layer 2 on the intersecting part 1a is 20μm or higher. That is, the printed- wiring board can be molded with one kind of molding resin and a freedom of resin selection is increased. Moreover, by providing an adhesion accelerating layer around the primary molding, the board can be roughened on a constant condition even if the molding resin is changed.
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