| 摘要 |
PURPOSE: To decrease a pressure at the time of bonding of piezoelectric ceramic plates to a metal plate, to improve the bonding strength of the piezoelectric ceramic plates without generating a crack in the piezoelectric ceramic plates, to lessen irregularity in the amount of displacement of a piezoelectric bimorph and to stabilize the electrical contact of the piezoelectric ceramic plates with the metal plate by a method wherein an external electrode is formed using a silver paste containing silver powder of specified particle diameters and a specified compositional ratio. CONSTITUTION: In a piezoelectric bimorph, 1-mm diameter through holes 4 are provided in the joints of a metal plate 1 with piezoelectric ceramic plates 2. Moreover, in the piezoelectric bimorph, as the piezoelectric ceramic plates 2 are respectively bonded to both surfaces of the above metal plate 1 with bonding agents 3, the bonding agents 3 on both surfaces of the plate 1 are formed into an integral structure through the holes 4. As the piezoelectric ceramic plates 2, the metal plate, the bonding agents and an external electrode, a lead zirconate titanate plate, a brass plate, an epoxy bonding agent and a silver paste, which contains silver powder in the range of a particle diameter of 3 to 8μm and silver powder in the range of a particle diameter of 12 to 15μm in a ratio of 9:1, are respectively used to obtain the piezoelectric bimorph.
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