| 摘要 |
PURPOSE: To provide a gold alloy fine wire for a semiconductor element which corresponds to a narrow pitch mode and a long span mode and is suitable for high density mount by reducing wire deformation during resin sealing. CONSTITUTION: This fine wire is a gold alloy fine wire for a semiconductor element which contains Pt:0.04 to 1.5wt.% and 0.004 to 0.06wt.% of one kind or two or more kinds of Y, Ca, La, Ce in total and whose remaining part consists of gold and its inevitable impurities and a gold alloy fine wire for a semiconductor element which contains 0.0005 to 0.05wt.% of one or two kinds of Al, In in total in addition to an element of the former fine wire. |
