发明名称 PREPARATION OF THERMAL INSULATION FOLDING BOARD
摘要 <p>PURPOSE: To avoid a bulge phenomenon generated by gas generated from the remaining solvent of an adhesive and remaining air being stored in the interface of adhesion with a metal sheet by applying the adhesive into an island-like shape or a belt-like shape on the face of the side adhered on the metal sheet as a closed-cell foamed sheet. CONSTITUTION: When a thermal insulation folding board 8 as an adhesive body 7 is prepd. by bonding together a metal sheet 3 and a closed-cell foamed sheet 1 by means of press rolls 5, the closed-cell foamed sheet 1 on one face of which an adhesive 2 is applied into a belt-like shape or an island-like shape is used. Air involved when bonded together by means of the press rolls is escaped to the outside of the bonded body through parts on which the adhesive 2 is not applied and even when the adhesive 2 remains, gas generated by evaporation of the solvent can be escaped to the outside of the bonded body 7 through parts on which the adhesive is not applied not to cause bulge phenomenon.</p>
申请公布号 JPH08290507(A) 申请公布日期 1996.11.05
申请号 JP19950101345 申请日期 1995.04.25
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 TOKUDA MASAO
分类号 E04B1/80;B32B5/18;B32B7/14;B32B15/08;B32B38/00;(IPC1-7):B32B5/18;B32B31/12 主分类号 E04B1/80
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