| 摘要 |
<p>PURPOSE: To easily pick up semiconductor chips without interference with the chips on the outer circumference by a method wherein after the semiconductor chips have been separated individually, a pick-up means, with which the semiconductor chips are air-sucked from their lower surface, is inserted and sucked from the gap where a film is exfoliated. CONSTITUTION: Each semiconductor chip is separated by cutting using a rotary blade of a dicing cutter along the scribe lines drawn on a semiconductor wafer 1. The pick-up board 4 of the semiconductor chip is inserted into the gap formed on the semiconductor wafer 1 and the pushed-down film 2. An air-sucking tool 20 supports a two-mm thick stainless steel air-suction supporting board 19 on which an airsuction arm tube is provided on a pick-up board 4 as an air pinset, and a semiconductor chip is picked up and moved following the rotation of a ball screw 22. The semiconductor chip, which is sucked by the pickup board 4, is separated from the film 2, and the chip is moved to the next process.</p> |
