发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND MULTILAYERED PRINTED CIRCUIT BOARD USING ITS CURED BODY AS INTERLAMINAR INSULATING LAYER
摘要 PURPOSE: To provide a photosensitive resin compsn. developable with an aq. soln. and excellent in flame retarding property because of an added flame retardant causing no problem on safety, environment, etc., and to provide a printed circuit board using the resin compsn. CONSTITUTION: An acrylate which cures when irradiated with light and a photopolymn. initiator are blended with condensed phosphoric acid amide. At least one among epoxy resin, epoxy acrylate having an epoxy residue and carboxyl group-contg. epoxy acrylate having an epoxy residue and an epoxy resin curing agent are further incorporated.
申请公布号 JPH08292567(A) 申请公布日期 1996.11.05
申请号 JP19950101038 申请日期 1995.04.25
申请人 HITACHI CHEM CO LTD 发明人 FUKAI HIROYUKI;TAKANEZAWA SHIN;TOMIOKA KENICHI;KAWAMOTO TOMOKO
分类号 G03F7/004;G03F7/027;H05K1/00;H05K3/46;(IPC1-7):G03F7/027 主分类号 G03F7/004
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