发明名称 POLYPROPYLENE-BASED RESIN COMPOSITION
摘要 PURPOSE: To obtain a polypropylehe-based resin composition excellent in impact resistance at a low temperature and rigidity and excellent in heat resistance and capable of being widely used as a base material ranging from various industrial parts to food and medical fields. CONSTITUTION: This resin composition comprises (A) 50-90wt.% polypropylene, (B) 1-35wt.% saturated triblock copolymer consisting of ethylene at the both ends and an ethylene-α-olefin copolymer in the central part, (C) 1-35wt.% unsaturated triblock copolymer consisting of polyethylene at the both ends and a polymer containing carbon-carbon double bonds in the central part, (D) 1-30wt.% polyorganosiloxane having silicon atoms bound with hydrogen atoms and silicon atoms bound with groups having carbon-carbon double bonds.
申请公布号 JPH08291238(A) 申请公布日期 1996.11.05
申请号 JP19950097165 申请日期 1995.04.21
申请人 SHOWA DENKO KK 发明人 TAKENOUCHI HIROSHI;WASHIYAMA JUNICHIRO;BEPPU TAKAYUKI;MAEDA HIROYUKI;SHIMIZU YOSHIMI;MOGI YOSHIHIRO
分类号 C08L23/10;C08L23/12;C08L53/00;C08L87/00;(IPC1-7):C08L23/10 主分类号 C08L23/10
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