RESIN-SEALED SEMICONDUCTOR DEVICE

摘要

PURPOSE: To prevent shift of semiconductor element and realize a low thermal resistance in the resin sealing process for a resin-sealed semiconductor device. CONSTITUTION: Shift of semiconductor element 3 in the resin sealing process can be prevented and low thermal resistance of a resin-sealed semiconductor device can be realized by molding a molded body having a cavity with a high thermal conductive resin 2 to the part lower than a lead frame 1 of the package of the resin-sealed semiconductor device and by sealing with thermosetting resin 6 after depositing a die pad 4 to the cavity to mount a semiconductor element 3.