| 摘要 |
PURPOSE: To obtain a highly reliable semiconductor device in which short circuit between adjacent bonding wires is prevented by coating the bonding wire uniformly with an insulating sleeve. CONSTITUTION: An IC chip 3 is bonded through a bonding wire 2 to the inner lead of a lead frame 4 and then the bonding wire 2 is applied with a cut sleeve of insulator 5. Subsequently, the sleeve of insulator 5 is pressed and secured to a predetermined position. |
