发明名称 MULTIPLEX CHIP ELECTRIC FIELD EFFECT ELECTRON EMISSION DEVICE AND ITS PREPARATION
摘要 <p>PROBLEM TO BE SOLVED: To evenly emit electrons by selectively etching a titanium-based adhesive layer make tips to spring up tip, based on the internal stress of tungsten itself. SOLUTION: After a titanium adhesive layer 12 is formed on a substrate 11 and a cathode 12 is formed, an Al layer is formed and etched to form a mask 14' for forming multiple- micro-tips and the tungsten cathode 13 is radially etched using the mask 14' to form a triangular multiple- micro-tip shape. Then, after an insulating layer 15 and a gate layer are formed on the substrate, a gate 16' is formed. The layer 15 in the lower part of an aperture 18 of the gate 16' is etched to form a hole 19. Next, the layer 12 is selectively etched to form multiple- micro-tips and obtain an element. At that time, the etching speed of the layer 12 is made extremely high and etching is completed within a short time, so that the tips which are multi-divided into triangular shapes is formed so as to spring up by the internal stress of tungsten.</p>
申请公布号 JPH08287820(A) 申请公布日期 1996.11.01
申请号 JP19960027102 申请日期 1996.02.14
申请人 SANSEI DENKAN KK 发明人 KIN SHIYOUBAI
分类号 H01J9/02;H01J1/30;H01J1/304;(IPC1-7):H01J1/30 主分类号 H01J9/02
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