| 摘要 |
PURPOSE: To obtain a die for resin sealing a semiconductor chip while eliminating inside bubbles from the resin molding and level difference on the surface thereof. CONSTITUTION: While taking account of the flow resistance by a lead frame 27 and a semiconductor chip 26 against a molten resin 12 flowing into a recess 7a forming the cavity 6 of an upper die 9, a movably piece 1 is provided as a variable flow resistance against the molten resin 12 flowing into the recess 7b of a lower die 8 thus making uniform the flow of the molten resin 12 in the cavity 6.
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