MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: To form a solder layer for bonding a pellet with uniform thickness while eliminating void therefrom. CONSTITUTION: When a collet 14 containing a vacuum sucked pellet 12 is mounted on the header 10 of a lead frame 1, a gap 18 is formed between the pellet 12 and the header 10. Molten solder 17 is then fed into the gap 18 through an injection tube 19 coupled with an opening made through the side wall of the collet 14. The air in the gap 18 is pushed out by the molten solder 17 through an air vent 20 made through the side wall of the collet 14. Since the gap is sustained constant by the collet at the time of feeding the molten solder, a solder layer having uniform and constant thickness can be formed. Furthermore, void can be eliminated from the solder layer, because the air in the gap is pushed out by the molten solder.