| 摘要 |
<p>PURPOSE: To provide an IC module which can reduce physical faults of the IC module for the IC card. CONSTITUTION: The IC module 100 for the IC card is constituted by providing a terminal part 150 on one surface of a base material, mounting an IC chip (semiconductor element) 120 on the other surface, and sealing the IC chip (semiconductor element) 120 with resin; and an insulating groove 152 of the terminal part 150 does not extend across all the areas of the IC chip 120, bonding wire 180, and sealing resin 130.</p> |
