发明名称 WEDGE PROBE
摘要 PROBLEM TO BE SOLVED: To obtain an improved contact between a wedge connector and an IC leg by providing an air gap between an insulation part and a conductor over the tip edge of a wedge with a thin tip. SOLUTION: The outside of a wedge 13 in sandwich structure is made of conductive surfaces 21 and 22 made of beryllium copper and a center core 25 is made of polyimide. The surfaces 21 and 22 are connected to the core 25 by adhesive layers 23 and 24. The adhesive layers 23 and 24 advance only halfway toward the tip of the wedge 14, thus obtaining air gaps 26 and 27. By providing the gaps 26 and 27, the wedge 14 can easily be over the tip regions when being compressed between a pair of adjacent legs 30 and 31 of an IC. An insertion force required for ensuring the contact between the wedge and the leg side surface of the IC decreases, for example, from 40 pounds to 10 pounds, thus easily improving a better contact.
申请公布号 JPH08292232(A) 申请公布日期 1996.11.05
申请号 JP19960027453 申请日期 1996.02.15
申请人 HEWLETT PACKARD CO <HP> 发明人 ROBAATO EICHI WAADOUERU
分类号 G01R31/26;G01R1/04;G01R1/073;G01R31/04;H01L21/66;H01R4/50;H01R13/24;H01R31/06;H01R33/76;(IPC1-7):G01R31/26 主分类号 G01R31/26
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