| 摘要 |
PURPOSE: To make it possible to connect the electrodes of a semiconductor device with bonding pads using short bonding wires, by depositing brazing material and a plating metal layer on the die pad, bonding pads and connecting conductor face on an insulating substrate, and forming a notch in the plating metal layer in such a direction that the connecting conductor will be divided. CONSTITUTION: A connecting conductor 10 that connects a die pad 6 and one of bonding pads 8, is deposited on a flat insulating substrate 1. Brazing material and a plating metal layer 11 composed of a metal excellent wettability, are deposited on the surface of the connecting conductor 10. A notch 12 is formed in the deposited plating metal layer 11 in such a direction that the connecting conductor 10 will be divided. This prevents bonding wires 9 from being unnecessarily lengthened when bonding a semiconductor device 4 to the die pad 6 with a conductive adhesive member 7 in between. That also makes it possible to firmly connect the electrodes of the semiconductor device 4 using bonding wires 9 with reliability. |
