| 摘要 |
PURPOSE: To lower the flow resistance in a flow passage when heat generating semiconductor parts are very closely mounted on the surface of a substrate by respectively providing nozzles which have nearly rectangular cross sections in parallel to the substrate and supply a coolant to a plurality of heat sinks on the end faces of the heat sinks opposite to the end faces of the heat sinks to which the semiconductor parts are fitted. CONSTITUTION: In an electronic device, heat sinks 13 are fitted to a plurality of heat generating semiconductor parts 12 on a substrate 11 and nozzles 14 having nearly rectangular cross section in parallel to the substrate 11 are respectively installed to the end faces of the heat sinks 13 opposite to the end faces of the heat sinks 13 to which the parts 12 are fitted. When the ratio of the distance Wd between adjacent heat sinks 13 to the mounting pitch Wf+Wd of the heat sinks 13 falls within the range of 0.00-0.02, the ratio of the widths Wn of the nozzles 14 through which a coolant is made to flow in the heat sinks 13 to the widths Wf of the heat sinks 13 is adjusted to 0.16-0.35. Therefore, a sufficient space can be secured to discharge exhaust air flows from the heat sinks 13. |
