| 摘要 |
PURPOSE: To make it possible to form solder bumps without performing plating and also without using Ar+H2 gas by forming gold bumps on a bare chip, dipping these gold bumps in molten solder and covering the gold bumps with solder. CONSTITUTION: A gold bump 7 is produced on an electrode 3 of a bare chip 1 by means of a gold bonding wire 5 requiring no Ar+H2 gas. Next, the bare chip 1 is dipped in a solder tank having molten solder 9 at a relatively low melting point with the surface formed with a gold bump 7 facing the bottom. And solder 9 is deposited on the top of a gold bump 7. Next, hot air is blown against the surface of the bare chip where the solder 9 was deposited, in order to blow off and remove a bridge 11 formed between gold bumps 7 and an excessive solder deposit 13 by means of a hot air pressure, thereby adjusting the thickness of solder 9. By doing this, the solder bumps can be formed without plating process and without using expensive Ar+H2 gas.
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