| 摘要 |
PURPOSE: To provide electronic components with bumps which can be surely soldered to the electrodes of a substrate even when the components are warping and a method for soldering electronic components. CONSTITUTION: Electronic components 1 are mounted on a substrate 7. Since the components 1 are warping, bumps 6' on both sides of the components 1 do not come into contact with the electrodes 8 of the substrate 7, but float in the air. The melting point of the bumps 6' is 200 deg.C which is higher than the thermally deforming temperature of the components, 185 deg.C. When the substrate 7 is heated to 185 deg.C in a heating furnace for reflow, all bumps 6' come into contact with the electrodes 8, because the components 1 are reformed to a straight state. Then the substrate 7 is heated to >=220 deg.C to melt the bumps 6' and stick the bumps 6' to the electrodes 8. When the substrate 7 is cooled thereafter, the warping of the components 1 is inhibited even when the components 1 tend to warp again when the temperature of the substrate 7 drops to 180 deg.C and the bumps 6' are accurately soldered to the electrodes 8. |
