| 摘要 |
PURPOSE: To provide an integrated circuit device against which impedance matching can be adjusted continuously with high accuracy and which can efficiently synthesize high-frequency signals and a method for manufacturing the device. CONSTITUTION: A thermoplastic resin body 120 connects an input impedance matching circuit 5 to the gate electrode of an FET 3 and the drain electrode of the FET 3 to an output impedance matching circuit 6. Another thermoplastic resin body 121 is connected to the circuit 5 on one side. A third thermoplastic resin body 122 connects the circuit 6 to lands 9 composed of island-like conductive films. Therefore, the variation of the high-frequency characteristic of an integrated circuit device can be reduced and the high-frequency signal synthesizing efficiency and reproducibility of the device can be improved. In addition, impedance matching can be adjusted continuously. |
