| 摘要 |
PURPOSE: To obtain a semiconductor device having face down mounting structure and a manufacturing method thereof in which the electrode pad on a semiconductor chip and a lead terminal can be bonded reliably by plating. CONSTITUTION: A guide tool 21 having guide holes 21c corresponding to electrode pads 11a is mounted on the surface of a semiconductor chip 11. Columnar lead terminals 12 are then fed into the guide holes 21c of the guide tool 21 thus realizing reliable contact between the lead terminal 12 and the electrode pad 11a. Bonding is effected by plating under a state where the lead terminal 12 is brought into reliable contact with the electrode pad 11a. |
