| 摘要 |
PURPOSE: To solve the problems that occur when sealing is conventionally performed after mounting, by giving sealing work before the mounting work for a semiconductor chip to be mounted on a circuit board. CONSTITUTION: A top surface of a wafer 11, where bump electrodes 12 are provided, is covered with a resin sealing film 16 by means of spin coating in such a manner that the top portions of the bump electrodes 12 are exposed. Next, the resin sealing film 16 is heated and hardened. Then, the wafer 11 is diced along dicing streets 13 and is divided into individual chips, and then a semiconductor device 17 as shown in the drawing with a partially enlarged portion can be obtained.
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