ENCAPSULATION OF TRANSMITTER AND RECEIVER MODULES

摘要

An encapsulated optocomponent comprises an optocomponent assembly (14) having an optical interface at one side, which comprises guide pins (27) for positioning a connected optical component or optical connector. The assembly (14) is attached to the outermost portion (10) of a flexible tongue (9), which is an integral part of a dielectric carrier such as a polymer carrier (7). On or inside the carrier and the tongue (9) thereof electrical conductive paths are arranged which are connected to the optoassembly (14) and to electrical driver circuits in a driver circuit assembly (13), so that the carrier also has the function of a conventional lead frame. The entire device is moulded into an encapsulating plastic material (25). In the moulding operation the positioning of the optoassembly in an accurately determined position and the retainment thereof in this position is facilitated by the flexibility of the tongue (9), not being affected for example by the fact that an injected encapsulating material may possibly displace the significantly larger driver circuit assembly (13) and its attachment area (5) on the carrier (7). This construction can also allow that only the optoassembly is encapsulated, the driver circuit assembly being protected in some other way, so that the flexible tongue (9) is exposed. This design can facilitate the accurate positioning of the optocomponent assembly on a circuit board.