摘要 |
<p>An ultraviolet-curing adhesive composition comprising a photopolymerization initiator exhibiting a molar absorption coefficient 400 or above at a wavelength of 360 to 450 nm and an ultraviolet-curing compound. This composition can bond substrates to each other, each substrate exhibiting a total transmittance of 0.01 to 20 % for the energy rays of 280 to 380 nm wavelength.</p> |