Inner coupling line to polymer foil bonding appts. for e.g. integrated circuit

摘要

The appts. includes inner coupling lines (1) located on the polymer foil (3) in a preset pattern, while bonding spots (6) serve for coupling to electrode bonding points (7) of a semiconductor chip (8). A thermo-compression device (5) provides the heat and pressure for the inner coupling lines. To the semiconductor chip is coupled a waste heat conducting device. On the inner coupling lines contacting clamps (4) are located heat conductors (L) of heat conducting material near the bonding position of the spots for preventing heat convection to the polymer foil from the thermo-compression device.