| 摘要 |
The apparatus includes a base member having an upper surface and a cavity therein, with a channel in the interior which communicates with the cavity. The surface has an aperture communicating with the cavity. A power semiconductor device is held in the aperture with an outer heat transfer surface of the device exposed in the cavity, and a fluid is circulated through the channel and cavity and across the heat transfer surface. A tunable weir in the cavity provides means for controlling the fluid, to minimize the thermal resistance between the heat transfer surface and the fluid.
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