发明名称 Curing oven for magazine holding computer chip lead frames, providing flow direction control for hot gas stream
摘要 PCT No. PCT/CH93/00131 Sec. 371 Date Jun. 7, 1994 Sec. 102(e) Date Jun. 7, 1994 PCT Filed May 21, 1993 PCT Pub. No. WO93/24801 PCT Pub. Date Dec. 9, 1993In the case of a curing installation, in particular for magazines with lead frames which are fitted with electronic chips, there is provided at least one box (R2) which can be closed by a door and in which at least one fan is arranged for subjecting the lead frames in the magazine to hot gas. The fan is supported on a housing of the box (R2) and is arranged in such a way that it produces in the region of the magazine at least one essentially horizontally directed gas stream essentially parallel to the longitudinal direction of the magazine, so that gas flows through the magazine. The fan may be designed as a helical fan or a radial fan, and the direction of the gas stream may be varied by reversal of the direction of rotation of the fan.
申请公布号 US5569402(A) 申请公布日期 1996.10.29
申请号 US19940190027 申请日期 1994.06.07
申请人 ESEC S.A. 发明人 MEISSER, CLAUDIO;HONEGGER, ROLF
分类号 C30B31/12;F26B21/02;F27B5/16;F27B17/00;H01L21/00;H01L21/52;(IPC1-7):F27B17/00 主分类号 C30B31/12
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