| 摘要 |
PURPOSE: To reduce contamination due to the release of carbon black by incorporating an olefin resin and a styrene/conjugated diene block copolymer into a conductive resin composition used for IC packaging and consisting of a thermoplastic resin and carbon black. CONSTITUTION: 100 pts.wt. of at least one thermoplastic resin (A) comprising a polyphenylene resin, a polystyrene resin or an ABS resin is blended with 5-50 pts.wt. carbon black (B), an olefin resin (C) in an amount of 1-30 pts.wt. based on 100 pts.wt. in total of components A and B, a styrene/conjugated diene block copolymer (D) in an amount of 0.2-10 pts.wt. based on 100 pts.wt. in total of components A and B, and if necessary, other additives to give the conductive resin composition for IC packaging, with a surface resistivity of 10<2> to 10<10>Ω.
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