发明名称 |
MOLDING OF RESIN MOLDING |
摘要 |
PURPOSE: To enhance the close adhesiveness of a thermosetting resin molding material and a coating material in a method for molding a resin molding by molding the thermosetting resin molding material using a split mold and subsequently injecting the coating material into the mold. CONSTITUTION: In a method for molding a resin molding by molding the thermosetting resin molding material 2 using a split mold 1, and subsequently injecting the coating material 3 into the mold, the set value of the surface temp. of the mold is made low in the direction separated from the arranging position of the thermosetting resin molding material 2. |
申请公布号 |
JPH08281676(A) |
申请公布日期 |
1996.10.29 |
申请号 |
JP19950086758 |
申请日期 |
1995.04.12 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD;NIPPON SHOKUBAI CO LTD |
发明人 |
YAMAUCHI SATORU;IKEGAWA NAOTO;AZUMA KEIJI;KOBAYAKAWA MASUNORI;MATSUMOTO MASAMI;TANAKA MITSUZO;OKA SHIGERU |
分类号 |
B29C33/02;B29C39/10;B29C39/12;B29C43/14;B29C43/20;B29C43/34;B29C43/52;B29C43/58;B29C45/14;B29K101/10;B29K105/06;B29L9/00;(IPC1-7):B29C43/14 |
主分类号 |
B29C33/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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