发明名称 |
MOISTURE-CURING SEALING AND BONDING COMPOUND |
摘要 |
Described is a moisture-curing sealing and bonding compound made from completely synthetic polymers, the compound containing, to improve its non-sag properties, a triglyceride, either as the sole non-sag agent or in addition to prior art agents. The triglyceride should have a melting point over 40 DEG C, preferably over 50 DEG C, and be derived from saturated fatty acids with 8 to 26 C-atoms. Even without using thixotropic agents, compounds can be obtained which do not sag at temperatures over 40 DEG C. Such joint sealants can be used to fill joints more than 35 mm wide without sagging. |
申请公布号 |
WO9633249(A1) |
申请公布日期 |
1996.10.24 |
申请号 |
WO1996EP01512 |
申请日期 |
1996.04.09 |
申请人 |
HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN;ERNST, WOLFGANG;MAJOLO, MARTIN;KLEIN, JOHANN;DZIALLAS, MICHAEL;PODOLA, TORE |
发明人 |
ERNST, WOLFGANG;MAJOLO, MARTIN;KLEIN, JOHANN;DZIALLAS, MICHAEL;PODOLA, TORE |
分类号 |
C08L75/00;C09D5/34;C09J127/06;C09J175/04;C09K3/10 |
主分类号 |
C08L75/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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