发明名称 |
METHOD OF ELECTROPLATING A SUBSTRATE, AND PRODUCTS MADE THEREBY |
摘要 |
Disclosed is an electroplating method and products made therefrom, which in one embodiment includes using a current density J0, to form a conductive metal layer (30) having a surface roughness no greater than the surface roughness (20) of the underlying member (10). In another embodiment of electroplating a substrate surface having peaks and valleys, the method includes electroplating a conductive metal onto the peaks to cover the peaks with the conductive metal, and into the valleys to substantially fill the valleys with the conductive metal.
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申请公布号 |
CA2218392(A1) |
申请公布日期 |
1996.10.24 |
申请号 |
CA19962218392 |
申请日期 |
1996.04.08 |
申请人 |
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS |
发明人 |
BROWN, WILLIAM D.;NASEEM, HAMEED A.;GLEZEN, JOHN H.;MALSHE, AJAY P.;SCHAPER, LEONARD W. |
分类号 |
C25D5/18;C25D5/00;C25D5/54;C25D7/00;(IPC1-7):C25D5/54 |
主分类号 |
C25D5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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