Curved surface measuring method, e.g. for optical waveguide
摘要
External deformities are produced on the outer surface of the waveguide for different optical waveguide spacings. These height differences from the ideal, straight profile can be detected by tangential illumination and simultaneous tangential image pickup by a camera (8). A reference blade (10) is provided at a small distance from the waveguide. A screen is provided in front of the light source (5) to generate parallel light beams. The camera is preferably a semiconductor CCD camera.
申请公布号
DE19514718(A1)
申请公布日期
1996.10.24
申请号
DE19951014718
申请日期
1995.04.21
申请人
SIEMENS AG, 80333 MUENCHEN, DE
发明人
EIGENSTETTER, HERBERT, 82152 PLANEGG, DE;HEPP, FRANZ, DIPL.-ING., 81739 MUENCHEN, DE