| 摘要 |
Planar array silicon chips 1' are micro-machined to incorporate tuning-fork sensors 2' of rotational acceleration, spatula sensors 9 of translational acceleration and surface formations. The chips are assembled in orthogonal arrangements by engaging the surface formations with one another. The formations may be a series of rectangular projections and recesses along the edges of the chips (8, figure 3) or body mortise holes 10 and corresponding protruding tenon tongues 11. Pads provide electrical connection between chips (7, fig 7). The pads on two chips could be connected by solder plugs (18, fig 7) or wire bonding (19, fig 8); or using electrically-conductive tangs (7', fig 10b), interlocking egde-lap joining forms (20, fig 11b) or residual interference-fit stress pressure (fig 9b). |
