Polyimide precursor, polyimide and their use

摘要

A polyimide precursor comprising repeating units of the formula: wherein each R<1> is a tetravalent organic group; and each R<2> is a divalent diphenyl group, has good image formation properties and is particularly suitable for forming a pattern using an i-line stepper, and provides a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, the photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.