发明名称 Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
摘要 A process for electroplating palladium or a palladium alloy onto an iron-nickel alloy substrate, which comprises the steps of: i) electroplating a metal selected from the group consisting of copper, tin, a nickel-tin alloy and a copper-tin alloy onto the substrate to form a first primer layer; ii) electroplating nickel or a gold alloy onto the first primer layer to form a second primer layer; and iii) electroplating palladium or a palladium alloy onto the second primer layer to from a palladium or a palladium alloy electroplating layer.
申请公布号 GB9619228(D0) 申请公布日期 1996.10.23
申请号 GB19960019228 申请日期 1996.09.13
申请人 MOON, SUNG S 发明人
分类号 C25D5/10;H01L21/48;H01L23/495 主分类号 C25D5/10
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