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发明名称
METHOD OF MANUFACTURING BONDED SEMICONDUCTOR SUBSTRATE
摘要
申请公布号
JPH08279442(A)
申请公布日期
1996.10.22
申请号
JP19950104735
申请日期
1995.04.04
申请人
MITSUBISHI MATERIALS SHILICON CORP;MITSUBISHI MATERIALS CORP
发明人
MORITA ETSURO;SAKAI SHINSUKE;KAWAI YUKIO
分类号
H01L21/02;H01L27/12;(IPC1-7):H01L21/02
主分类号
H01L21/02
代理机构
代理人
主权项
地址
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