| 摘要 |
PURPOSE: To prevent connection failures at the mounting of semiconductor devices, that are with the lead frame of multiple pins and narrow pitches, on a circuit board. CONSTITUTION: Outer leads 102a and 102b are bent each to outward and to inward against a resin mold 101 in turn, after a inner lead 151 and a semiconductor chip 120 are sealed by the resin mold 101. The shape, formed by the bent outer leads 102a and 102b and seen from the side of each outer leads 102a and 102b, is approximately the shape of inverted V. Forming by bending the outer leads 102a and 102b is performed while dam bars are left as connecting parts and the dam bars are cut off by laser light after the forming. |
