REGENERATING METHOD FOR WAFER CLAMPING DEVICE

摘要

PURPOSE: To provide a method to regenerate a wafer clamping device into such a state that completely prevents production of particles. CONSTITUTION: When a wafer clamping device 1 in a sputtering device is to be regenerated, an exposed surface 5 near a wafer holding part 3 of the wafer clamping device 1 where a film forming material is deposited is preferably polished by a ultrasonic polishing device to reduce the thickness of the film forming material remaining to <=10μm.