发明名称 Thermal print head
摘要 A thermal print head, including a resistance substrate having a front and rear surface, a plurality of heating elements formed on the front surface of the resistance substrate for converting electrical energy into heat energy, a cooling board for dissipating heat generated from the heating elements and the resistance substrate, wherein the cooling board is divided into separable first and second parts, the first part being disposed opposite the rear surface of the resistance substrate and below the heating elements; and a cooling compound with high thermal conductivity inserted between the first part of the cooling board and the rear surface of the resistance substrate.
申请公布号 US5568175(A) 申请公布日期 1996.10.22
申请号 US19950554338 申请日期 1995.11.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SUH, SUHN-JI;YANG, HONG-GEUN
分类号 B41J2/335;B41J29/377;(IPC1-7):B41J2/335;B41J2/34 主分类号 B41J2/335
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