发明名称 Resin transfer molding in combination with honeycomb core
摘要 A process for making a layered product having a honeycomb core having empty cells, the process comprising the steps of: (a) placing a first layer of an uncured adhesive film on the top side of a central honeycomb core having empty cells, and placing a second layer of an uncured adhesive film on the bottom side of the central honeycomb core; (b) placing a first layer of an uncured prepreg material above the first layer of uncured adhesive film, and placing a second layer of an uncured prepreg material below the second layer of uncured adhesive film; (c) placing a first layer of a dry fiber preform above the first layer of uncured prepreg material, and placing a second layer of a dry fiber preform below the second layer of uncured prepreg material; (d) placing the charge made by steps (a)-(c) inside a mold and closing the mold; (e) heating the mold to the cure temperature of the adhesive film and the prepreg material, and holding the mold at this temperature for sufficient time to cure the adhesive film and the prepreg material; (f) reducing the temperature of the mold to the injection temperature of a selected resin transfer molding (RTM) resin system, and injecting the selected resin transfer molding (RTM) resin system into the mold; (g) holding the temperature of the mold at the cure temperature for the resin transfer molding (RTM) resin system for sufficient time to cure the resin system; and, (h) removing the product from the mold after curing is completed.
申请公布号 US5567499(A) 申请公布日期 1996.10.22
申请号 US19950368062 申请日期 1995.01.03
申请人 THE BOEING COMPANY 发明人 CUNDIFF, THOMAS R.;FRYE, BRADLEY A.
分类号 B29C70/08;B29C70/48;B29C70/54;B29D24/00;B32B3/12;(IPC1-7):B32B3/12 主分类号 B29C70/08
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