发明名称 METHOD FOR MARKING TO THERMOSETTING RESIN, AND ASSEMBLING EQUIPMENT WITH MARKING DEVICE
摘要 PURPOSE: To improve the thermal shock resistance, weatherability and frictional resistance of a stamp by a method wherein the pasting of a label is made unnecessary at the marking to a urea resin molded article. CONSTITUTION: A molded article 4 is obtained by molding material containing urea resin, silicon and pigment by direct pressure molding method. Laser light source 1 radiates laser beams, which are emitted from carbon dioxide gas laser and have the energy density of 255kW/cm<2> or less, onto the surface of the molded article 4 so as to apply a stamp 6.
申请公布号 JPH08276506(A) 申请公布日期 1996.10.22
申请号 JP19950082366 申请日期 1995.04.07
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KONDO TAKESHI
分类号 B23K26/00;B29C71/04;B29K61/20;B29K83/00;B29K101/10 主分类号 B23K26/00
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