| 发明名称 |
Semiconductor device-encapsulating epoxy resin composition |
| 摘要 |
A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.
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| 申请公布号 |
US5567749(A) |
申请公布日期 |
1996.10.22 |
| 申请号 |
US19940328617 |
申请日期 |
1994.10.25 |
| 申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
SAWAMURA, YASUSHI;TESHIBA, TOSHIHIRO;TANAKA, MASAYUKI |
| 分类号 |
C08G59/24;C08G59/62;H01L23/29;(IPC1-7):C08L63/00 |
主分类号 |
C08G59/24 |
| 代理机构 |
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