| 摘要 |
PURPOSE: To reduce the generation of the misregistration of a green sheet, the expansion and contraction of the sheet and the like and to improve the reliability of a multilayer interconnection ceramic board. CONSTITUTION: An organic solvent C is added to the mixed powder of an alumina powder body A and a binder B to mix, the mixture is formed into a slurry and a green sheet is formed using this slurry in a process S1. A through hole is formed in a prescribed position, which is previously fixed, on this green sheet in a process S2. A transfer sheet is formed in a process S3 in parallel to the formation of the green sheet and a wiring pattern is formed on the transfer sheet in a process S4. The green sheets and the transfer sheets are laminated in a prescribed order in a process S5, the integral formation of the plurality of sheets is conducted by thermocompression bonding in a process S6 and a green laminated material is obtained. A firing is performed on the green laminated material in a process S7 and the transfer sheets are are vaporized to obtain a ceramic board E. |
