| 摘要 |
PURPOSE: To contrive a miniaturization of a semiconductor package and a reduction in the thickness of the package by a method wherein external connection terminal parts connected with chip electrodes are provided via connection holes which are formed by communicating with chip electrodes in the thickness direction of the package. CONSTITUTION: In a semiconductor package 10, a semiconductor chip 11 is sealed with a sealing part 12. A plurality of chip electrodes 13 are formed on an electrode formation surface 11a of the chip 11. A chip rear 11b on the opposite side to the surface 11a is bonded to a thin plate-shaped die pad part 14 with a die bonding material 15. Connection holes 16 are provided in the resin part 12 in the thickness direction of the package 10 in such a way as to communicate with the chip electrodes 13. The holes 16 are filled with a conductive material, such as a a solder or copper, and external connection terminal parts 17 are formed of this conductive material. The terminal parts 17 are formed in a state of some projection from the package surface (the resin surface) and these projected parts are connected with electrode parts on a mother board or the like at the time of packaging of the package. |
