| 摘要 |
PURPOSE: To suppress power source noise and prevent the characteristic degradation of a semiconductor device which has unused vacant electrode pads among the electrode pads on the LSI chip. CONSTITUTION: The unused vacant pads on an LSI chip 11 are used as a VDD exclusive pad 12d and a VSS exclusive pad 12e. Power (VDD) is supplied to the VDD exclusive pad 12d from the external through the lead terminal part 32 of the VDD exclusive lead 31. Power (VSS) is supplied to the VSS exclusive pad 12e from the external through a lead 23', which is one of the leads 23 of a lead frame 21. Thus, number of power supply pad is increased and power system is improved. |
